Crystal structure of bis­(2-methyl-1H-imidazole-κN 3)(meso-tetra-p-tol­ylporphyrinato-κ4 N)iron(III) perchlorate tetra­hydro­furan sesquisolvate

by Sun, Wenyan, Li, Jianfeng
Published 2016

Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints

by Li, Jianfeng, Dai, Jingru, Johnson, Christopher Mark
Published 2018

Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

by Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark
Published 2014

Selection of materials for IGBT modules to achieve stable short circuit failure behaviour

by Li, Jianfeng, Yaqub, Imran, Johnson, Christopher Mark
Published 2016

Dependence of overcurrent failure modes of IGBT modules on interconnect technologies

by Yaqub, Imran, Li, Jianfeng, Johnson, Christopher Mark
Published 2015

Design and construction of a co-planar power bus interconnect for low inductance switching

by Lin, Xi, Li, Jianfeng, Johnson, Mark
Published 2017

A PARALIND Decomposition-Based Coherent Two-Dimensional Direction of Arrival Estimation Algorithm for Acoustic Vector-Sensor Arrays

by Zhang, Xiaofei, Zhou, Min, Li, Jianfeng
Published 2013

Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

by Li, Jianfeng, Agyakwa, Pearl A., Johnson, C. Mark
Published 2016

Integrated half-bridge switch using 70-μm-thin devices and hollow interconnects

by Solomon, Adane Kassa, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark
Published 2015

Reliable integration of a high performance multi-chip half-bridge SiC power module

by Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark
Published 2016

Interconnect materials enabling IGBT modules to achieve stable short circuit failure behavior

by Li, Jianfeng, Yaqub, Imran, Corfield, Martin, Johnson, Christopher Mark
Published 2017

Hybrid half-bridge package for high voltage application

by Mouawad, Bassem, Li, Jianfeng, Castellazzi, Alberto, Johnson, Christopher Mark
Published 2015

Sintered-silver bonding of high-temperature piezoelectric ceramic sensors

by Billore, Justine, Hascoët, Stanislas, Robutel, Rémi, Buttay, Cyril, Li, Jianfeng
Published 2017

Time-efficient sintering processes to attach power devices using nanosilver dry film

by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark
Published 2017

Association between Four MMP-9 Polymorphisms and Breast Cancer Risk: A Meta-Analysis

by Zhang, Xiaoli, Jin, Guoyin, Li, Jianfeng, Zhang, Linxi
Published 2015

Dynamic mechanical response and a constitutive model of Fe-based high temperature alloy at high temperatures and strain rates

by Su, Xiang, Wang, Gang, Li, Jianfeng, Rong, Yiming
Published 2016

Wavelet coherence analysis of cerebral oxygenation signals measured by near-infrared spectroscopy in sailors: an exploratory, experimental study

by Bu, Lingguo, Li, Jianfeng, Li, Fangyi, Liu, Heshan, Li, Zengyong
Published 2016

Plasmid pORF-hTRAIL targeting to glioma using transferrin-modified polyamidoamine dendrimer

by Gao, Song, Li, Jianfeng, Jiang, Chen, Hong, Bo, Hao, Bing
Published 2015

Multifocal sclerosing angiomatoid nodular transformation of the spleen: a case report and review of literature

by Cao, Zhixin, Wang, Qiangxiu, Li, Jiamei, Xu, Jiawen, Li, Jianfeng
Published 2015

Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects

by Li, Jianfeng, Castellazzi, Alberto, Dai, Tianxiang, Corfield, Martin, Solomon, Adane Kassa, Johnson, Christopher Mark
Published 2015