Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects
A stacked substrate–chip–bump–chip–substrate assembly has been demonstrated in the construction of power switch modules with high power density and good electrical performance. In this paper, special effort has been devoted to material selection and geometric shape of the bumps in the design for imp...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers
2015
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| Online Access: | http://eprints.nottingham.ac.uk/30002/ http://eprints.nottingham.ac.uk/30002/ http://eprints.nottingham.ac.uk/30002/ http://eprints.nottingham.ac.uk/30002/1/06895288.pdf |