Creep and microstructural development in P91 weldments at elevated temperature

by Agyakwa, Pearl
Published 2004

Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

by Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark
Published 2014

Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

by Yang, Li, Agyakwa, Pearl A., Johnson, C. Mark
Published 2013

Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement

by Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl, Johnson, C. Mark
Published 2016

Response to comments on “A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds”

by Li, Jianfeng, Agyakwa, Pearl A., Johnson, C. Mark
Published 2016

Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes

by Li, J.F., Agyakwa, Pearl, Johnson, Christopher Mark
Published 2014

A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

by Agyakwa, Pearl, Yang, Li, Corfield, Martin, Johnson, Christopher Mark
Published 2014

Time-efficient sintering processes to attach power devices using nanosilver dry film

by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark
Published 2017

Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules

by Yang, Li, Agyakwa, Pearl, Corfield, Martin, Johnson, Mark, Harris, Anne, Packwood, Matthew, Paciura, Krzysztof
Published 2018

Comparative thermal and structural characterization of sintered nano-silver and high-lead solder die attachments during power cycling

by Dai, Jingru, Li, Jianfeng, Agyakwa, Pearl, Corfield, Martin, Johnson, Christopher Mark
Published 2018

Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment

by Wang, Yun, Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark, Li, Shuguang
Published 2014

Predicting lifetime of thick Al wire bonds using signals obtained from ultrasonic generator

by Arjmand, Elahjeh, Agyakwa, Pearl, Corfield, Martin, Li, Jianfeng, Johnson, Christopher Mark
Published 2016

Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K

by Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin, Johnson, Christopher Mark
Published 2016

A thermal cycling reliability study of ultrasonically bonded copper wires

by Arjmand, Elaheh, Agyakwa, Pearl A., Corfield, Martin R., Li, Jianfeng, Mouawad, Bassem, Mark Johnson, C.
Published 2016

Packaging/assembling technologies for a high performance SiC-based planar power module

by Li, Jianfeng, Agyakwa, Pearl, Evans, Paul, Johnson, Christopher Mark, Zhao, Yimin, Wu, Yibo, Evans, Kim
Published 2014