Author Search Results

1

Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip

by J.H., Lau
Published 1997

Other Authors: “...J.H., Lau...”

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2

Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards

by John H., Lau
Published 2001

Other Authors: “...John H., Lau...”

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3

The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies

by J.H., Lau
Published 1997

Other Authors: “...J.H., Lau...”

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4

Bending and twisting of cylindrical solder interconnections with creep

by John H., Lau
Published 2001

Other Authors: “...John H., Lau...”

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5

Overview and outlook of through‐silicon via (TSV) and 3D integrations

by John H., Lau
Published 2011

Other Authors: “...John H., Lau...”

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6

Creep of 96.5Sn3.5Ag Solder Interconnects

by J.H., Lau
Published 1993

Other Authors: “...J.H., Lau...”

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7

Thermoelastic Problems for Electronic Packaging

by J.H., Lau
Published 1991

Other Authors: “...J.H., Lau...”

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8

Effect of Chip Dimension and Substrate Thickness on the Solder Joint Reliability of Plastic Ball Grid Array Packages

by S.‐W., Lee, J.H., Lau
Published 1997

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9

An overview of microvia technology

by John H., Lau, Chris, Chang
Published 2000

Other Authors: “...John H., Lau...”

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10

TMA, DMA, DSC and TGA of lead free solders

by John H., Lau, Chris, Chang
Published 1999

Other Authors: “...John H., Lau...”

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11

Design for Plastic Ball Grid Array Solder Joint Reliability

by S.‐W.R., Lee, J.H., Lau
Published 1997

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12

Analysis and comparison of WLCSP‐on‐build‐up PCB assemblies with various solders and microvia configurations

by S.‐W., Ricky Lee, John H., Lau
Published 2002

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13

Solder joint reliability of cavity‐down plastic ball grid array assemblies

by S.‐W., Ricky Lee, John H., Lau
Published 1998

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14

Solder joint reliability of plastic ball grid array with solder bumped flip chip

by Shi‐Wei, Ricky Lee, John H., Lau
Published 2000

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15

Value challenges in supply chain management

by W.K., Poon, K.H., Lau
Published 2000

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16

Research universities versus teaching universities ‐ public perceptions and preferences

by Eugene H., Fram, Gloria H., Lau
Published 1996

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17

Design, analysis and measurement of the cost‐effective substrate of a plastic ball grid array package ‐ NuBGA

by John H., Lau, Tony, Chen, Tai‐Yu, Chou
Published 1999

Other Authors: “...John H., Lau...”

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18

Hooking‐up: a unique feature of China Public Accounting Firms

by Xinmin, Dai, Amy H., Lau, Ji‐liang, Yang
Published 2000

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19

Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA

by John H., Lau, K.L., Chen, F., Wu
Published 1998

Other Authors: “...John H., Lau...”

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20

Performance improvement of international roaming service ‐ A benchmarking study

by K.S., Chin, K.F., Pun, C.S., Lau, H., Lau
Published 2001

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