Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards

Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards

Bibliographic Details
Main Author: John H., Lau
Format: text
Language:eng
Published: Emerald 2001
Subjects:
Printed circuit boards,Elastoplasticity,Chip scale packaging,Build‐up technology,Microvias

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