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Thermal performance of a low‐c...
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Thermal performance of a low‐cost thermal enhanced plastic ball grid array package ‐ NuBGA
Bibliographic Details
Main Authors:
John H., Lau
,
K.L., Chen
,
F., Wu
Format:
text
Language:
eng
Published:
Emerald
1998
Subjects:
Electronic packaging,Plastic ball grid array,Thermal performance
Holdings
Description
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