Thermoelastic Problems for Electronic Packaging

Similar Items

• Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip
  by: J.H., Lau
  Published: (1997)
• The cauchy problem for the system of equations of thermoelasticity in En
  by: Nur Munawwarah
  Published: (2014)
• Numerical modeling of thermoelastic generation of ultrasound by laser irradiation in the coupled thermoelasticity
  by: Veres, István A., et al.
  Published: (2013)
• Numerical model of a thermoelastic actuator solved as a coupled contact problem
  by: Ivo, Doležel, et al.
  Published: (2007)
• Numerical solution of 1D and 2D thermoelastic coupled problems.
  by: Khaldjigitov, Abduvali, et al.
  Published: (2012)