Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each...
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| Format: | Article |
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Elsevier
2013
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S0013468612019950 http://www.sciencedirect.com/science/article/pii/S0013468612019950 |