Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each...

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Main Authors:	Goh, Y., Haseeb, A.S.M.A., Sabri, M.F.M.
Format:	Article
Published:	Elsevier 2013
Subjects:	TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery
Online Access:	http://www.sciencedirect.com/science/article/pii/S0013468612019950 http://www.sciencedirect.com/science/article/pii/S0013468612019950

id	um-11757
recordtype	eprints
spelling	um-117572015-01-09T02:17:56Z Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder Goh, Y. Haseeb, A.S.M.A. Sabri, M.F.M. TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each bath was investigated. The combination of HQ and gelatin successfully reduces the deposition potential gap between the elements hence facilitates the co-deposition of Sn–Bi in this plating bath. Compact, adherent deposits could be obtained through the synergistic effects of these two additives. The electroplated Sn–Bi deposits showed a decrease in Bi content with increasing current density. Near eutectic Sn–60.75 wt.% Bi alloy was successfully deposited from the bath containing both HQ and gelatin at a current density of 18 mA cm−2. Elsevier 2013-02-15 Article PeerReviewed http://www.sciencedirect.com/science/article/pii/S0013468612019950 Goh, Y.; Haseeb, A.S.M.A.; Sabri, M.F.M. (2013) Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder. Electrochimica Acta <http://eprints.um.edu.my/view/publication/Electrochimica_Acta.html>, 90. pp. 265-273. ISSN 0013-4686 http://eprints.um.edu.my/11757/
repository_type	Digital Repository
institution_category	Local University
institution	University Malaya
building	UM Research Repository
collection	Online Access
topic	TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery
spellingShingle	TA Engineering (General). Civil engineering (General) TJ Mechanical engineering and machinery Goh, Y. Haseeb, A.S.M.A. Sabri, M.F.M. Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
description	The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn–Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each bath was investigated. The combination of HQ and gelatin successfully reduces the deposition potential gap between the elements hence facilitates the co-deposition of Sn–Bi in this plating bath. Compact, adherent deposits could be obtained through the synergistic effects of these two additives. The electroplated Sn–Bi deposits showed a decrease in Bi content with increasing current density. Near eutectic Sn–60.75 wt.% Bi alloy was successfully deposited from the bath containing both HQ and gelatin at a current density of 18 mA cm−2.
format	Article
author	Goh, Y. Haseeb, A.S.M.A. Sabri, M.F.M.
author_facet	Goh, Y. Haseeb, A.S.M.A. Sabri, M.F.M.
author_sort	Goh, Y.
title	Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
title_short	Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
title_full	Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
title_fullStr	Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
title_full_unstemmed	Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder
title_sort	effects of hydroquinone and gelatin on the electrodeposition of sn–bi low temperature pb-free solder
publisher	Elsevier
publishDate	2013
url	http://www.sciencedirect.com/science/article/pii/S0013468612019950 http://www.sciencedirect.com/science/article/pii/S0013468612019950
first_indexed	2018-09-06T06:01:07Z
last_indexed	2018-09-06T06:01:07Z
_version_	1610836782402764800

Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

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