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Analysis of warpage and residu...
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Analysis of warpage and residual stress in plastic ball grid array package after post mold cure
Bibliographic Details
Main Authors:
Sung, Yi
,
Tatiana M., Lam
Format:
text
Language:
eng
Published:
Emerald
2012
Subjects:
Stress (materials),Thermal expansion,Plastics,Microelectronics packaging,Ball grid arrays
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