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Popcorning in PBGA Packages Du...
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Popcorning in PBGA Packages During IR Reflow Soldering
Bibliographic Details
Main Authors:
P., McCluskey
,
R., Munamarty
,
M., Pecht
Format:
text
Language:
eng
Published:
Emerald
1997
Subjects:
Plastic ball grid array,Electronics packaging,Popcorning,Microelectronics
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