Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K
Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation approach. The occurrence of irreversible deformation of the microstructure an...
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| Format: | Article |
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Springer
2016
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| Online Access: | https://eprints.nottingham.ac.uk/33365/ |
| _version_ | 1848794614898622464 |
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| author | Agyakwa, Pearl Yang, Li Arjmand, Elahjeh Evans, Paul Corfield, Martin Johnson, Christopher Mark |
| author_facet | Agyakwa, Pearl Yang, Li Arjmand, Elahjeh Evans, Paul Corfield, Martin Johnson, Christopher Mark |
| author_sort | Agyakwa, Pearl |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation approach. The occurrence of irreversible deformation of the microstructure and wear-out under such conditions were demonstrated. The observed microstructures consist of interfacial and inter-granular cracks concentrated in zones of stress intensity, i.e., near heels and emanating from interface precracks. Interfacial voids were also observed within the bond interior. Degradation rates of ‘first’ and ‘stitch’ bonds are compared and contrasted. A correlative microscopy study combining perspectives from optical microscopy with the x-ray tomography results clarifies the damage observed. An estimation of lifetime is made from the results and discussed in the light of existing predictions. |
| first_indexed | 2025-11-14T19:19:00Z |
| format | Article |
| id | nottingham-33365 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:19:00Z |
| publishDate | 2016 |
| publisher | Springer |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-333652020-05-04T17:45:42Z https://eprints.nottingham.ac.uk/33365/ Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K Agyakwa, Pearl Yang, Li Arjmand, Elahjeh Evans, Paul Corfield, Martin Johnson, Christopher Mark Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation approach. The occurrence of irreversible deformation of the microstructure and wear-out under such conditions were demonstrated. The observed microstructures consist of interfacial and inter-granular cracks concentrated in zones of stress intensity, i.e., near heels and emanating from interface precracks. Interfacial voids were also observed within the bond interior. Degradation rates of ‘first’ and ‘stitch’ bonds are compared and contrasted. A correlative microscopy study combining perspectives from optical microscopy with the x-ray tomography results clarifies the damage observed. An estimation of lifetime is made from the results and discussed in the light of existing predictions. Springer 2016-04-20 Article PeerReviewed Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin and Johnson, Christopher Mark (2016) Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Journal of Electronic Materials . pp. 1-14. ISSN 1543-186X Aluminum wire bonds power cycling reliability x-ray tomography high cycle thermal fatigue http://link.springer.com/article/10.1007%2Fs11664-016-4519-0 doi:10.1007/s11664-016-4519-0 doi:10.1007/s11664-016-4519-0 |
| spellingShingle | Aluminum wire bonds power cycling reliability x-ray tomography high cycle thermal fatigue Agyakwa, Pearl Yang, Li Arjmand, Elahjeh Evans, Paul Corfield, Martin Johnson, Christopher Mark Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K |
| title | Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K |
| title_full | Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K |
| title_fullStr | Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K |
| title_full_unstemmed | Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K |
| title_short | Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K |
| title_sort | damage evolution in al wire bonds subjected to a junction temperature fluctuation of 30 k |
| topic | Aluminum wire bonds power cycling reliability x-ray tomography high cycle thermal fatigue |
| url | https://eprints.nottingham.ac.uk/33365/ https://eprints.nottingham.ac.uk/33365/ https://eprints.nottingham.ac.uk/33365/ |