Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K
Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation approach. The occurrence of irreversible deformation of the microstructure an...
| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
Springer
2016
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/33365/ |