Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules
This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temper...
| Main Authors: | , , |
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| Format: | Article |
| Published: |
Institute of Electrical and Electronics Engineers
2013
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| Online Access: | https://eprints.nottingham.ac.uk/2422/ |
| _version_ | 1848790781588930560 |
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| author | Yang, Li Agyakwa, Pearl A. Johnson, C. Mark |
| author_facet | Yang, Li Agyakwa, Pearl A. Johnson, C. Mark |
| author_sort | Yang, Li |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire
bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological
considerations based on some unusual observations
highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model. |
| first_indexed | 2025-11-14T18:18:04Z |
| format | Article |
| id | nottingham-2422 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:18:04Z |
| publishDate | 2013 |
| publisher | Institute of Electrical and Electronics Engineers |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-24222020-05-04T20:19:36Z https://eprints.nottingham.ac.uk/2422/ Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules Yang, Li Agyakwa, Pearl A. Johnson, C. Mark This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temperature on bond wear-out behavior and damage removal phenomena resulting from thermally activated processes is not addressed. The phenomenological considerations based on some unusual observations highlight the need for new approaches to wire bond life prediction models and thus motivate the proposal of a new time-domain damage-based crack propagation model. Institute of Electrical and Electronics Engineers 2013-03 Article PeerReviewed Yang, Li, Agyakwa, Pearl A. and Johnson, C. Mark (2013) Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. IEEE Transactions on Device and Materials Reliability, 13 (1). pp. 9-17. ISSN 1530-4388 http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=6392232 doi:10.1109/TDMR.2012.2235836 doi:10.1109/TDMR.2012.2235836 |
| spellingShingle | Yang, Li Agyakwa, Pearl A. Johnson, C. Mark Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| title | Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| title_full | Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| title_fullStr | Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| title_full_unstemmed | Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| title_short | Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| title_sort | physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules |
| url | https://eprints.nottingham.ac.uk/2422/ https://eprints.nottingham.ac.uk/2422/ https://eprints.nottingham.ac.uk/2422/ |