Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules
This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temper...
| Main Authors: | , , |
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| Format: | Article |
| Published: |
Institute of Electrical and Electronics Engineers
2013
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| Online Access: | https://eprints.nottingham.ac.uk/2422/ |