Characterizations of FPGA chip electromagnetic emissions based on GTEM cell measurements
Miniaturized, dense integration and high operating frequencies of FPGAs are factors contributing to electromagnetic emissions. Consequently the radiation issue that used to be discussed at PCB level has shifted to component level. Thus it is of interest and challenging to investigate chip electromag...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2012
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/6120/ http://eprints.uthm.edu.my/6120/1/Characterizations_of_FPGA_Chip_Electromagnetic.pdf |
| Summary: | Miniaturized, dense integration and high operating
frequencies of FPGAs are factors contributing to electromagnetic
emissions. Consequently the radiation issue that used to be
discussed at PCB level has shifted to component level. Thus it is
of interest and challenging to investigate chip electromagnetic
performance. GTEM cell is widely accepted to characterize chip
emission and the common measurement practice is mounting the
device under test at the GTEM cell body. This paper presents an
alternative approach to measure electromagnetic emissions by
locating the entire FPGA test board inside the GTEM cell instead
of mounting it at the wall of the cell. Before measurements, the
FPGA board is properly shielded with metallic enclosure to
avoid unintentional contribution from supporting components on
the board. During measurements, the shielded FPGA board is
arranged in horizontal or vertical positions and for each position
the FPGA chip is configured with two different logic circuits.
The results have shown a significant impact of FPGA chip
positions and IO pins on the electromagnetic emissions. |
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