Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

Deployment of an automatic visual inspection system in semiconductor industry has become increasingly popular than ever not only due to its relatively high value as a yield analysis tool of outgoing products but more importantly for the prevention of defect escapee. A lot of studies are done on the...

Full description

Bibliographic Details
Main Authors: Ngie, David Chua Sing, Shahrol, Mohamaddan, Shirley, Anak Jonathan Tanjong, Abdullah, bin Yassin, Lim, Soh Fong
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2018
Subjects:
TA Engineering (General). Civil engineering (General)
Online Access:http://ir.unimas.my/19916/
http://ir.unimas.my/19916/
http://ir.unimas.my/19916/
http://ir.unimas.my/19916/1/Detection-of-Bond-Pad-Discolorations-at-Outgoing-Wafer-Inspections_2018_IEEE-Transactions-on-Semiconductor-Manufacturing.html

Internet

http://ir.unimas.my/19916/
http://ir.unimas.my/19916/
http://ir.unimas.my/19916/
http://ir.unimas.my/19916/1/Detection-of-Bond-Pad-Discolorations-at-Outgoing-Wafer-Inspections_2018_IEEE-Transactions-on-Semiconductor-Manufacturing.html

Similar Items