Detection of Bond Pad Discolorations at Outgoing Wafer Inspections

by Ngie, David Chua Sing, Shahrol, Mohamaddan, Shirley, Anak Jonathan Tanjong, Abdullah, bin Yassin, Lim, Soh Fong
Published 2018

Analysis of production planning activities in remanufacturing system

by Magdalene, anak Andrew Munot, Abdullah, bin Hj. Yassin, Syed Tarmizi, bin Syed Shazali, Marini, binti Sawawi, Shirley, Anak Jonathan Tanjong, Nur Tahirah, binti Razali
Published 2018