An experimental study on precision grinding of silicon using diamond grinding pins

An experimental study on precision grinding of silicon using diamond grinding pins

Silicon substrates are difficult to grind to good surface finishes using conventional machining. Ductile mode machining is often required to have flawless machining but this requires the use of expensive machine tools. However, precision grinding using conventional machine tools could generate large...

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Bibliographic Details
Main Authors: Alao, Abdur-Rasheed, Konneh, Mohamed
Format: Article
Language:English
Published: Inderscience Enterprises Ltd. 2011
Subjects:
TJ1125 Machine shops and machine shop practice
Online Access:http://irep.iium.edu.my/7723/
http://irep.iium.edu.my/7723/
http://irep.iium.edu.my/7723/
http://irep.iium.edu.my/7723/1/IJMatEI0203-0410_ALAO.pdf
id iium-7723
recordtype eprints
spelling iium-77232011-12-20T12:44:16Z http://irep.iium.edu.my/7723/ An experimental study on precision grinding of silicon using diamond grinding pins Alao, Abdur-Rasheed Konneh, Mohamed TJ1125 Machine shops and machine shop practice Silicon substrates are difficult to grind to good surface finishes using conventional machining. Ductile mode machining is often required to have flawless machining but this requires the use of expensive machine tools. However, precision grinding using conventional machine tools could generate large amounts of ductile streaks on ground silicon surfaces under good machining conditions. High wheel rotation, slow feed rate, small indentations and small grain sizes are the practical requirements to realise precision grinding of silicon. Therefore, this study examines the feasibility of quantitative determination of the criteria to realise precision grinding of silicon on an NC milling machine with factorial experimental design. The result shows massive ductile streaks at depth of cut, 20 μm; feed rate, 6.25 mm/min and spindle speed of 70,000 rpm with a 43 nm Ra. Spindle speed affects mostly the surface finish. The combined effects of depth of cut and feed rate on Ra and Rt which add to the complexity in the precision grinding process are investigated. Inderscience Enterprises Ltd. 2011 Article PeerReviewed application/pdf en http://irep.iium.edu.my/7723/1/IJMatEI0203-0410_ALAO.pdf Alao, Abdur-Rasheed and Konneh, Mohamed (2011) An experimental study on precision grinding of silicon using diamond grinding pins. International Journal Materials Engineering Innovation (IJMATEI), 2 (3-4). pp. 325-345. ISSN 1757-2762 (O), 1757-2754 (P) http://www.inderscience.com/search/index.php?action=record&rec_id=42885 10.1504/IJMATEI.2011.042885
repository_type Digital Repository
institution_category Local University
institution International Islamic University Malaysia
building IIUM Repository
collection Online Access
language English
topic TJ1125 Machine shops and machine shop practice
spellingShingle TJ1125 Machine shops and machine shop practice
Alao, Abdur-Rasheed
Konneh, Mohamed
An experimental study on precision grinding of silicon using diamond grinding pins
description Silicon substrates are difficult to grind to good surface finishes using conventional machining. Ductile mode machining is often required to have flawless machining but this requires the use of expensive machine tools. However, precision grinding using conventional machine tools could generate large amounts of ductile streaks on ground silicon surfaces under good machining conditions. High wheel rotation, slow feed rate, small indentations and small grain sizes are the practical requirements to realise precision grinding of silicon. Therefore, this study examines the feasibility of quantitative determination of the criteria to realise precision grinding of silicon on an NC milling machine with factorial experimental design. The result shows massive ductile streaks at depth of cut, 20 μm; feed rate, 6.25 mm/min and spindle speed of 70,000 rpm with a 43 nm Ra. Spindle speed affects mostly the surface finish. The combined effects of depth of cut and feed rate on Ra and Rt which add to the complexity in the precision grinding process are investigated.
format Article
author Alao, Abdur-Rasheed
Konneh, Mohamed
author_facet Alao, Abdur-Rasheed
Konneh, Mohamed
author_sort Alao, Abdur-Rasheed
title An experimental study on precision grinding of silicon using diamond grinding pins
title_short An experimental study on precision grinding of silicon using diamond grinding pins
title_full An experimental study on precision grinding of silicon using diamond grinding pins
title_fullStr An experimental study on precision grinding of silicon using diamond grinding pins
title_full_unstemmed An experimental study on precision grinding of silicon using diamond grinding pins
title_sort experimental study on precision grinding of silicon using diamond grinding pins
publisher Inderscience Enterprises Ltd.
publishDate 2011
url http://irep.iium.edu.my/7723/
http://irep.iium.edu.my/7723/
http://irep.iium.edu.my/7723/
http://irep.iium.edu.my/7723/1/IJMatEI0203-0410_ALAO.pdf
first_indexed 2018-09-07T03:29:07Z
last_indexed 2018-09-07T03:29:07Z
_version_ 1610917816454610944

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