Copper Ball‐wedge Bonding and Its Problems
Main Author: | L., Tielemans |
---|---|
Format: | text |
Language: | eng |
Published: |
Emerald
1988
|
Similar Items
-
Copper Ball/Wedge Bonding to Copper Thick Film
by: R.V., Winkle, et al.
Published: (1988) -
Analysis of the Ball‐forming Process in Copper Ball Bonding
by: F., Hongyuan, et al.
Published: (1992) -
Numerical Analysis of the Ball Forming Process in Copper Ball Bonding
by: F., Hongyuan, et al.
Published: (1993) -
Some aspects on free air ball (FAB) formation of copper wire bonding
by: Husna Zayadi
Published: (2008) -
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
by: Chong, Leong Gan, et al.
Published: (2013)