Characterisation of insulated Cu wire ball bonding
Insulated Cu wire technology offers potential solutions for fine and ultra-fine pitch wire bonding as the insulator coating on the bare wire prevents wires shorting problem. Most previous works focused on insulated wire stitch bonding. This paper presents a comparison study between insulated Cu and...
| Main Authors: | , , , , , |
|---|---|
| Published: |
2018
|
| Online Access: | http://dspace.uniten.edu.my/jspui/handle/123456789/8785 |