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Morphology transformation on Cu3Sn grains during the formation of full Cu3Sn solder joints in electronic packaging
Bibliographic Details
Main Authors:
Peng, Yao
,
Xiaoyan, Li
,
Fengyang, Jin
,
Yang, Li
Format:
text
Language:
eng
Published:
Emerald
2018
Subjects:
Cu3Sn grains,Electronic packaging,Full Cu3Sn solder joints,Morphology transformation
Holdings
Description
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