$Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging$

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

Bibliographic Details
Main Authors:	Peng, Yao, Xiaoyan, Li, Xu, Han, Liufeng, Xu
Format:	text
Language:	eng
Published:	Emerald
Subjects:	Shear strength,Conventional interfacial structure,Cu3Sn proportion,Fracture mechanism,Full Cu-Sn IMCs joints

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

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