Interfacial reaction of a Sn‐3.0Ag‐0.5Cu thin film during solder reflow

Bibliographic Details
Main Authors:	Liu, Mei Lee, Habsah, Haliman, Ahmad, Azmin Mohamad
Format:	text
Language:	eng
Published:	Emerald 2013
Subjects:	Solders,Alloys,Thin films,Intermetallics,Thermal properties,SAC305,Lead‐free

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