Fuzzy logic approach for investigation of microstructure and mechanical properties of Sn96.5-Ag3.0-Cu0.5 lead free solder alloy

Bibliographic Details
Main Authors:	Muhammad, Aamir, Izhar, Muhammad, Waqas, Muhammad, Iqbal, Muhammad Imran, Hanif, Riaz, Muhammad
Format:	text
Language:	eng
Published:	Emerald 2017
Subjects:	Fuzzy logic,Mechanical properties,Intermetallic compound,Lead free solder,Thermal aging

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