Skip to content
VuFind
All Fields
Title
Author
Subject
Call Number
ISBN/ISSN
Tag
Find
Advanced
PCB‐design follows IC‐packagin...
Holdings
Cite this
Export Record
Export to RefWorks
Export to EndNoteWeb
Export to EndNote
PCB‐design follows IC‐packaging
Bibliographic Details
Main Authors:
J., Kloeser
,
W., Scheel
Format:
text
Language:
eng
Published:
Emerald
2000
Subjects:
Printed circuit boards,Chip scale packaging,Design
Holdings
Description
Similar Items
Staff View
Similar Items
A low‐cost solder‐bumped chip scale package ‐NuCSP
by: John H., Lau, et al.
Published: (1998)
Elastic, elastic‐plastic and creep analyses of wafer level chip scale package solder joints on microvia build‐up printed circuit boards
by: John H., Lau
Published: (2001)
Effects of chip scale package and flip‐chip on the design and manufacturing of electronic products
by: Petri, Savolainen
Published: (1998)
Optimal printed wiring board design for high I/O density chip size packages
by: Chirag S., Patel, et al.
Published: (1999)
Design, materials and process for lead‐free assembly of high‐density packages
by: Joe, Smetana, et al.
Published: (2004)
×
Loading...