A practical investigation on nickel plated copper heat spreader with different catalytic activation processes for flip-chip ball grid array packages

by Amin, N., Lim, V., Seng, F.C., Razid, R., Ahmad, I.
Published 2017

Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

by Lim, V., Ahmad, I., Seng, F.C., Amin, N., Rasid, R.
Published 2017

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

by Kar, Y.B., Talik, N.A., Sauli, Z., Seng, F.C., Yong, T.C., Retnasamy, V.
Published 2018

Flux residue cleaning process optimization effect on Flip Chip Ball Grid Array reliability

by Kar, Y.B., Tahk, N.A., Seng, F.C., Yang, L.H., Vithyacharan, R., Yong, T.C.
Published 2018