Tilt Detection Of Connectors Using Phase Shifting.

by Retnasamy, V, Ratnam, Mani Maran, Sundaraj, K, Sauli, Zaliman
Published 2007

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

by Kar, Y.B., Talik, N.A., Sauli, Z., Seng, F.C., Yong, T.C., Retnasamy, V.
Published 2018

Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

by Kar, Y.B., Talik, N.A., Sauli, Z., Fei, J.S., Retnasamy, V.
Published 2018