Root cause analysis support for quality improvement in electronics manufacturing

by L.A.M., Huertas‐Quintero, P.P., Conway, D.M., Segura‐Velandia, A.A., West
Published 2011

Modelling of Solder Joint Geometry for Quality and Reliability

by D.C., Whalley, P.P., Conway, F., Sarvar, D.J., Williams
Published 1995

Observed Phenomenology of the Interaction between Solder Paste and Soldering Processes

by M.R., Kalantary, F., Sarvar, P.P., Conway, D.J., Williams, D.C., Whalley
Published 1994