The constraints of vias and layers and their impact on PCB design strategy

by P.J., Palmer, D.J., Williams
Published 1999

Characterization of a solder paste printing process and its optimization

by Gary K.K., Poon, D.J., Williams
Published 1999

Offshore investment strategies and technological upgrading in electronics manufacture in South‐East Asia

by D.J., Williams, K.J., Tilley
Published 1996

An analysis of technology trends within the electronics industry

by P.J., Palmer, D.J., Williams
Published 2000

Understanding Anisotropic Conducting Adhesive Behaviour

by J.M., Goward, D.C., Whalley, D.J., Williams
Published 1995

Anisotropic Conducting Adhesives for Electronic Interconnection

by D.J., Williams, D.C., Whalley, O.A., Boyle, A.O., Ogunjimi
Published 1993

Modelling of Solder Joint Geometry for Quality and Reliability

by D.C., Whalley, P.P., Conway, F., Sarvar, D.J., Williams
Published 1995

Observed Phenomenology of the Interaction between Solder Paste and Soldering Processes

by M.R., Kalantary, F., Sarvar, P.P., Conway, D.J., Williams, D.C., Whalley
Published 1994

The first evaluation of formaldehyde column observations by improved Pandora spectrometers during the KORUS-AQ field study

by E. Spinei, E. Spinei, A. Whitehill, A. Fried, M. Tiefengraber, M. Tiefengraber, T. N. Knepp, T. N. Knepp, S. Herndon, J. R. Herman, J. R. Herman, M. Müller, M. Müller, N. Abuhassan, N. Abuhassan, A. Cede, A. Cede, D. Richter, J. Walega, J. Crawford, J. Szykman, J. Szykman, L. Valin, D. J. Williams, R. Long, R. J. Swap, Y. Lee, N. Nowak, B. Poche
Published 2018-08-01