Advanced flip chip packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...
| Main Authors: | , , |
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| Format: | Book |
| Language: | English |
| Published: |
New York :
Springer ,
c2013
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| Subjects: |
Table of Contents:
- 1. Market trends: past, present, and future
- 2. Technology trends: past, present, and future
- 3. Bumping technologies
- 4. Flip-chip interconnections: past, present and future
- 5. Flip-chip underfill: materials, process, and reliability
- 6. Conductive adhesives for flip chip applications
- 7. Substrate technology
- 8. IC-package-system integration design
- 9. Thermal management of flip chip packages
- 10. Thermo-mechanical reliability in flip chip packages
- 11. Interfacial reactions and electromigration