Advanced flip chip packaging
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...
| Main Authors: | , , |
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| Format: | Book |
| Language: | English |
| Published: |
New York :
Springer ,
c2013
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| Subjects: |
Tembila General Collection
| Call Number: |
TK7870 15 A38 2013 |
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| Accession | Item Category | Format | Status | Notes |
|---|
| 1000156625 | OPEN SHELF (30 DAYS) | Book | Available |