Advanced flip chip packaging

Bibliographic Details
Main Authors: Lai, Yi-Shao (Author), Tong, Ho-Ming (Author), Wong, C. P. (Author)
Format: Book
Language:English
Published: New York Springer c2013
Subjects:

Tembila General Collection

Holdings details from Tembila General Collection
Call Number: TK7870 15 A38 2013
Accession Item Category Format Status Notes
1000156625 OPEN SHELF (30 DAYS) Book Available