Advanced flip chip packaging

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Advanced flip chip packaging

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for f...

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Bibliographic Details
Main Authors:	Lai, Yi-Shao (Author), Tong, Ho-Ming (Author), Wong, C. P. (Author)
Format:	Book
Language:	English
Published:	New York : Springer , c2013
Subjects:	Electronic packaging Flip chip technology

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