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110921s2013 nyu eng |
| 020 |
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|a 1441957677 (hardback : alk. paper)
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| 020 |
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|a 9781441957672 (hardback : alk. paper)
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| 020 |
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|a 9781441957689 (ebook)
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| 050 |
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|a TK7870.15
|b .A38 2013
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| 090 |
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|a TK7870.15
|b .A38 2013
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| 245 |
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|a Advanced flip chip packaging
|c Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, editors
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| 260 |
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|a New York :
|b Springer ,
|c c2013
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| 300 |
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|a vii, 560 p. :
|b ill. ;
|c 24 cm.
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| 504 |
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|a Includes bibliographical references
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| 505 |
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|a 1. Market trends: past, present, and future -- 2. Technology trends: past, present, and future -- 3. Bumping technologies -- 4. Flip-chip interconnections: past, present and future -- 5. Flip-chip underfill: materials, process, and reliability -- 6. Conductive adhesives for flip chip applications -- 7. Substrate technology -- 8. IC-package-system integration design -- 9. Thermal management of flip chip packages -- 10. Thermo-mechanical reliability in flip chip packages -- 11. Interfacial reactions and electromigration
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| 520 |
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|a Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable. This book also:Offers broad-ranging chapters with a focus on IC-package-system integration.Provides viewpoints from leading industry executives and experts.Details state-of-the-art achievements in process technologies and scientific research.Presents a clear development history and touches on trends in the industry while also discussing up-to-date technology information.Advanced Flip Chip Packaging is an ideal book for engineers, researchers, and graduate students interested in the field of flip chip packaging
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| 650 |
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|a Electronic packaging
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| 650 |
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|a Flip chip technology
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| 700 |
1 |
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|a Lai, Yi-Shao ,
|e author
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| 700 |
1 |
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|a Tong, Ho-Ming ,
|e author
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| 700 |
1 |
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|a Wong, C. P. ,
|e author
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| 999 |
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|a 1000156625
|b Book
|c OPEN SHELF (30 DAYS)
|e Tembila Campus
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