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110921s2013 nyu eng |
| 020 |
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|a 1441957677 (hardback : alk. paper)
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| 020 |
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|a 9781441957672 (hardback : alk. paper)
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| 020 |
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|a 9781441957689 (ebook)
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| 050 |
0 |
0 |
|a TK7870.15
|b .A38 2013
|
| 090 |
0 |
0 |
|a TK7870.15
|b .A38 2013
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| 245 |
0 |
0 |
|a Advanced flip chip packaging
|c Ho-Ming Tong, Yi-Shao Lai, C.P. Wong, editors
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| 260 |
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|a New York
|b Springer
|c c2013
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| 300 |
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|a vii, 560 p.
|b ill.
|c 24 cm
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| 650 |
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0 |
|a Electronic packaging
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| 650 |
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0 |
|a Flip chip technology
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| 700 |
1 |
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|a Lai, Yi-Shao
|e author
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| 700 |
1 |
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|a Tong, Ho-Ming
|e author
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| 700 |
1 |
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|a Wong, C. P.
|e author
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| 999 |
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|a 1000156625
|b Book
|c OPEN SHELF (30 DAYS)
|e Tembila Campus
|