APA (7th ed.) Citation

Lai, Y., Tong, H., & Wong, C. P. (2013). Advanced flip chip packaging. Springer.

Chicago Style (17th ed.) Citation

Lai, Yi-Shao, Ho-Ming Tong, and C. P. Wong. Advanced Flip Chip Packaging. New York: Springer, 2013.

MLA (9th ed.) Citation

Lai, Yi-Shao, et al. Advanced Flip Chip Packaging. Springer, 2013.