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00000cam a2200000 7i4500 |
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20110509.0 |
| 008 |
110228s2009 nyu eng |
| 020 |
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|a 1607416751 (electronic bk.)
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| 020 |
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|a 9781604564518
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| 020 |
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|a 9781607416753 (electronic bk.)
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| 050 |
0 |
0 |
|a TK7874.53
|b .H83 2009
|
| 090 |
0 |
0 |
|a TK7874.53
|b .H83 2009
|
| 100 |
1 |
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|a Heubner, Renae ,
|e author
|
| 245 |
1 |
0 |
|a Advanced Ta-based diffusion barriers for Cu interconnects [
|h electronic resource]
|c Renae Heubner
|
| 260 |
|
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|a New York :
|b Nova Science Publishers ,
|c c2009
|
| 300 |
|
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|a 1 online resource (93 p.) :
|b ill
|
| 500 |
|
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|a Description based on print version record
|
| 504 |
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|a Includes bibliographical references (p [73]-86) and index
|
| 650 |
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0 |
|a Electrodiffusion
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| 650 |
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0 |
|a Integrated circuits
|
| 650 |
|
0 |
|a Interconnects (Integrated circuit technology)
|
| 856 |
4 |
0 |
|3 NetLibrary
|u http://www.netlibrary.com/urlapi.asp?action=summary&v=1&bookid=281179
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| 999 |
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|a 1000137141
|b Electronic Resource
|c OPEN SHELF (30 DAYS)
|e Gong Badak Campus
|