Advanced MEMS packaging [
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging
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| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hil ,
c2010
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| Online Access: | NetLibrary |
Table of Contents:
- 1. Enabling technologies for advanced MEMS packaging
- 2. Advanced MEMS wafer-level packaging
- . Optical MEMS packaging : communications
- 4. Optical MEMS packaging : bubble switch
- 5. Optical MEMS : microbolometer packaging
- 6. Bio-MEMS packaging
- 7. Biosensor packaging
- 8. Accelerometer packaging
- 9. Radiofrequency MEMS switches
- 10. RF MEMS tunable capacitors and tubable band-pass filters
- 11. Advanced packaging of RF MEMS devices