Advanced MEMS packaging [
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging
| Main Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hil ,
c2010
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| Subjects: | |
| Online Access: | NetLibrary |
Internet
NetLibraryBadak Internet Collection
| Call Number: |
TK7875 A378 2010 |
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| Accession | Item Category | Format | Status | Notes |
|---|
| 1000137065 | OPEN SHELF (30 DAYS) | Electronic Resource | Available |