Advanced MEMS packaging

Bibliographic Details
Main Author: Lau, John H. (Author)
Format: Book
Language:English
Published: New York McGraw-Hil c2010
Subjects:
Online Access:NetLibrary

Internet

NetLibrary

Badak Internet Collection

Holdings details from Badak Internet Collection
Call Number: TK7875 A378 2010
Accession Item Category Format Status Notes
1000137065 OPEN SHELF (30 DAYS) Electronic Resource Available