Advanced MEMS packaging [

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Advanced MEMS packaging [

This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging

Bibliographic Details
Main Author:	Lau, John H. (Author)
Format:	Book
Language:	English
Published:	New York : McGraw-Hil , c2010
Subjects:	Microelectromechanical systems Microelectronic packaging
Online Access:	NetLibrary

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