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00000cam a2200000 7i4500 |
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20180108093000.0 |
| 008 |
110227s2010 nyu eng |
| 020 |
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|a 0071626239 (alk. paper)
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| 020 |
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|a 0071627928 (NetLibrary e-ISBN)
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| 020 |
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|a 0071741836 (McGraw-Hill e-ISBN)
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| 020 |
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|a 9780071626231 (alk. paper)
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| 020 |
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|a 9780071627924 (NetLibrary e-ISBN)
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| 020 |
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|a 9780071741835 (McGraw-Hill e-ISBN)
|
| 050 |
0 |
0 |
|a TK7875
|b .A378 2010
|
| 090 |
0 |
0 |
|a TK7875
|b .A378 2010
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| 245 |
1 |
0 |
|a Advanced MEMS packaging [
|h electronic resource]
|c John H Lau ... [et al.]
|
| 260 |
|
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|a New York :
|b McGraw-Hil ,
|c c2010
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| 300 |
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|a 1 online resource (xxiii, 552 p.) :
|b ill
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| 500 |
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|a Description based on print version record
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| 504 |
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|a Includes bibliographical references and index
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| 505 |
0 |
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|a 1. Enabling technologies for advanced MEMS packaging -- 2. Advanced MEMS wafer-level packaging -- . Optical MEMS packaging : communications -- 4. Optical MEMS packaging : bubble switch -- 5. Optical MEMS : microbolometer packaging -- 6. Bio-MEMS packaging -- 7. Biosensor packaging --8. Accelerometer packaging -- 9. Radiofrequency MEMS switches -- 10. RF MEMS tunable capacitors and tubable band-pass filters -- 11. Advanced packaging of RF MEMS devices
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| 520 |
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|a This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging
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| 650 |
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|a Microelectromechanical systems
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| 650 |
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0 |
|a Microelectronic packaging
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| 700 |
1 |
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|a Lau, John H. ,
|e author
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| 856 |
4 |
0 |
|3 NetLibrary
|u http://www.netlibrary.com/urlapi.asp?action=summary&v=1&bookid=291511
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| 999 |
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|a 1000137065
|b Electronic Resource
|c OPEN SHELF (30 DAYS)
|e Gong Badak Campus
|