Advanced MEMS packaging [
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging
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| Format: | Book |
| Language: | English |
| Published: |
New York :
McGraw-Hil ,
c2010
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| Subjects: | |
| Online Access: | NetLibrary |
| Summary: | This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging |
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| Item Description: | Description based on print version record |
| Physical Description: | 1 online resource (xxiii, 552 p.) : ill |
| Bibliography: | Includes bibliographical references and index |
| ISBN: | 0071626239 (alk. paper) 0071627928 (NetLibrary e-ISBN) 0071741836 (McGraw-Hill e-ISBN) 9780071626231 (alk. paper) 9780071627924 (NetLibrary e-ISBN) 9780071741835 (McGraw-Hill e-ISBN) |