APA (7th ed.) Citation

Fauzi, M. R., Amiruddin, N. A., Osman, S. A., & Mohamed Anuar, R. A. (2022). Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process. Trans Tech Publications.

Chicago Style (17th ed.) Citation

Fauzi, Muhamad Razizy, Nurul Amira Amiruddin, Saliza Azlina Osman, and Rabiatul Adawiyah Mohamed Anuar. Interfacial Reaction Between SAC3807 Lead-free Solders and Different Copper Substrate via Reflow Soldering Process. Trans Tech Publications, 2022.

MLA (9th ed.) Citation

Fauzi, Muhamad Razizy, et al. Interfacial Reaction Between SAC3807 Lead-free Solders and Different Copper Substrate via Reflow Soldering Process. Trans Tech Publications, 2022.