Interfacial reaction between SAC3807 lead-free solders and different copper substrate via reflow soldering process
The different composition material of copper substrate significantly affects the intermetallic compound (IMC) formation and the solder joints durability. This study was conducted on the interfacial reaction between lead-free solder and the different copper substrates via reflow soldering. The s...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2022
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| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/7168/ http://eprints.uthm.edu.my/7168/1/P13799_ca974b0f5af06ec4a8dad91f88901bfc.pdf |