Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate

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Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate

The growth of intermetallic compounds (IMCs) of the tin-silver-copper-nickel/electroless nickel immersion silver (SACN/ENImAg) at the 230 °C during multiple reflows was investigated. The characterization analysis of the samples was conducted using scanning electron microscopy and assisted by a dispe...

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Bibliographic Details
Main Authors:	M.A., Rabiatul Adawiyah, S.A., Amirul, O., Saliza Azlina, H., Syafiq
Format:	Article
Published:	Wiley-VCH Verlag 2020
Subjects:	TN Mining engineering. Metallurgy
Online Access:	http://eprints.uthm.edu.my/6380/

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