Impact of multiple reflow on intermetallic compound of nickel-doped tin-silver-copper on ENImAg substrate
The growth of intermetallic compounds (IMCs) of the tin-silver-copper-nickel/electroless nickel immersion silver (SACN/ENImAg) at the 230 °C during multiple reflows was investigated. The characterization analysis of the samples was conducted using scanning electron microscopy and assisted by a dispe...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Published: |
Wiley-VCH Verlag
2020
|
| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/6380/ |