Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

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Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

The surface finish of electroless nickel/immersion silver (ENImAg) has been developed as an alternative to lead-free surface finish in electronic industry for the reduction of metal cost without affecting the reliability and solderability performance. In this study, different types of lead-free sold...

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Bibliographic Details
Main Authors:	M.A., Rabiatul Adawiyah, O., Saliza Azlina
Format:	Article
Language:	English
Published:	ScienceDirect 2018
Subjects:	T Technology (General) TA401-492 Materials of engineering and construction. Mechanics of materials
Online Access:	http://eprints.uthm.edu.my/5599/ http://eprints.uthm.edu.my/5599/1/AJ%202018%20%28262%29.pdf

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