Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method
The lead trim-and-form process is important in the manufacturing of programmable logic devices, microprocessors, and memories. Normally, inspection of a chip package is performed in a lead inspection machine after the lead forming process to detect defects on the leads. One such defect is the lead i...
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| Format: | Article |
| Language: | English |
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springer
2012
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| Online Access: | http://eprints.utem.edu.my/id/eprint/4147/ http://eprints.utem.edu.my/id/eprint/4147/1/ck.kok-10.1007_s11664-012-1918-8.pdf |
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| author | Kok, Chee Kuang J.W.C. Chin M.M. Rajmohan V.S.H. Yeo Said, Md Radzai |
| author_facet | Kok, Chee Kuang J.W.C. Chin M.M. Rajmohan V.S.H. Yeo Said, Md Radzai |
| author_sort | Kok, Chee Kuang |
| building | UTeM Institutional Repository |
| collection | Online Access |
| description | The lead trim-and-form process is important in the manufacturing of programmable logic devices, microprocessors, and memories. Normally, inspection of a chip package is performed in a lead inspection machine after the lead forming process to detect defects on the leads. One such defect is the lead intermetallic compound (IMC) crack, exhibiting itself as plating crack. In this study, IMC crack of package leads, which causes loose connection between the
copper lead and the tin plating, was analyzed using the finite-element method. The simulation results were verified by matching the simulated and actual formed lead profile. Simulation results showed a strong correlation between IMC crack after forming and aging and high residual tensile strain induced during lead forming. A proposal was made to resolve the crack issue by performing
design of experiment (DOE) to reduce the residual tensile strain of the lead upon forming. Three optimization parameters were chosen, namely the forming angle, the shank angle, and the pre-forming angle. It is shown that, with the optimized parameter setting, a reduction of the residual strain can be achieved, thus minimizing the risk of IMC crack. |
| first_indexed | 2025-11-15T19:47:22Z |
| format | Article |
| id | utem-4147 |
| institution | Universiti Teknikal Malaysia Melaka |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T19:47:22Z |
| publishDate | 2012 |
| publisher | springer |
| recordtype | eprints |
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| spelling | utem-41472021-12-29T13:30:03Z http://eprints.utem.edu.my/id/eprint/4147/ Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method Kok, Chee Kuang J.W.C. Chin M.M. Rajmohan V.S.H. Yeo Said, Md Radzai The lead trim-and-form process is important in the manufacturing of programmable logic devices, microprocessors, and memories. Normally, inspection of a chip package is performed in a lead inspection machine after the lead forming process to detect defects on the leads. One such defect is the lead intermetallic compound (IMC) crack, exhibiting itself as plating crack. In this study, IMC crack of package leads, which causes loose connection between the copper lead and the tin plating, was analyzed using the finite-element method. The simulation results were verified by matching the simulated and actual formed lead profile. Simulation results showed a strong correlation between IMC crack after forming and aging and high residual tensile strain induced during lead forming. A proposal was made to resolve the crack issue by performing design of experiment (DOE) to reduce the residual tensile strain of the lead upon forming. Three optimization parameters were chosen, namely the forming angle, the shank angle, and the pre-forming angle. It is shown that, with the optimized parameter setting, a reduction of the residual strain can be achieved, thus minimizing the risk of IMC crack. springer 2012-02-07 Article PeerReviewed text en http://eprints.utem.edu.my/id/eprint/4147/1/ck.kok-10.1007_s11664-012-1918-8.pdf Kok, Chee Kuang and J.W.C. Chin and M.M. Rajmohan and V.S.H. Yeo and Said, Md Radzai (2012) Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method. Journal of Electronic Materials, 41 (4). pp. 774-781. ISSN 0361-5235 https://link.springer.com/article/10.1007/s11664-012-1918-8 10.1007/s11664-012-1918-8 |
| spellingShingle | Kok, Chee Kuang J.W.C. Chin M.M. Rajmohan V.S.H. Yeo Said, Md Radzai Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method |
| title | Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method |
| title_full | Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method |
| title_fullStr | Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method |
| title_full_unstemmed | Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method |
| title_short | Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method |
| title_sort | investigating the effects of lead forming parameters on intermetallic layer crack using the finite-element method |
| url | http://eprints.utem.edu.my/id/eprint/4147/ http://eprints.utem.edu.my/id/eprint/4147/ http://eprints.utem.edu.my/id/eprint/4147/ http://eprints.utem.edu.my/id/eprint/4147/1/ck.kok-10.1007_s11664-012-1918-8.pdf |