Investigating The Effects Of Lead Forming Parameters On Intermetallic Layer Crack Using The Finite-Element Method
The lead trim-and-form process is important in the manufacturing of programmable logic devices, microprocessors, and memories. Normally, inspection of a chip package is performed in a lead inspection machine after the lead forming process to detect defects on the leads. One such defect is the lead i...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
springer
2012
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| Online Access: | http://eprints.utem.edu.my/id/eprint/4147/ http://eprints.utem.edu.my/id/eprint/4147/1/ck.kok-10.1007_s11664-012-1918-8.pdf |