Silver Spot Plating Technique.
Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bond...
| Main Authors: | , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2005
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| Subjects: | |
| Online Access: | http://eprints.usm.my/9773/ http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf |
| _version_ | 1848870829290422272 |
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| author | Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. |
| author_facet | Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. |
| author_sort | Siah, C.H. |
| building | USM Institutional Repository |
| collection | Online Access |
| description | Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using
electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process.
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| first_indexed | 2025-11-15T15:30:24Z |
| format | Conference or Workshop Item |
| id | usm-9773 |
| institution | Universiti Sains Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-15T15:30:24Z |
| publishDate | 2005 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | usm-97732013-07-13T04:14:31Z http://eprints.usm.my/9773/ Silver Spot Plating Technique. Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. TP1-1185 Chemical technology Electroplating play an important roles in semiconductor manufacturing industries. A layer of silver or gold was selectively plated on the surface of lead frame by using electroplating technology. The purpose of depositing a layer of gold or silver on the surface of lead frame is to improve the bondability during die attach and wire bonding process. 2005-01 Conference or Workshop Item PeerReviewed application/pdf en http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf Siah, C.H. and Aziz, N. and Samad, Z and Idris, M. N. and Miskam, M.A. (2005) Silver Spot Plating Technique. In: Proceedings of the 4" Mechanical Engineering Research Colloquium (MERC 200511), 27-29 January 2005, School of Mechanical Engineering, USM, Penang, Malaysia. |
| spellingShingle | TP1-1185 Chemical technology Siah, C.H. Aziz, N. Samad, Z Idris, M. N. Miskam, M.A. Silver Spot Plating Technique. |
| title | Silver Spot Plating Technique. |
| title_full | Silver Spot Plating Technique. |
| title_fullStr | Silver Spot Plating Technique. |
| title_full_unstemmed | Silver Spot Plating Technique. |
| title_short | Silver Spot Plating Technique. |
| title_sort | silver spot plating technique. |
| topic | TP1-1185 Chemical technology |
| url | http://eprints.usm.my/9773/ http://eprints.usm.my/9773/1/Silver_Spot_Plating_Technique_%28PPKKimia%29_2005.pdf |