Aziz, A. H. (2018). Numerical Analysis Of Ultra-Fine Package Assembly With SAC305-TiO2 Nano-Reinforced Lead Free Solder At Different Peak Temperature. Universiti Sains Malaysia.
Chicago Style (17th ed.) CitationAziz, Asyraf Hasif. Numerical Analysis Of Ultra-Fine Package Assembly With SAC305-TiO2 Nano-Reinforced Lead Free Solder At Different Peak Temperature. Universiti Sains Malaysia, 2018.
MLA (9th ed.) CitationAziz, Asyraf Hasif. Numerical Analysis Of Ultra-Fine Package Assembly With SAC305-TiO2 Nano-Reinforced Lead Free Solder At Different Peak Temperature. Universiti Sains Malaysia, 2018.
Warning: These citations may not always be 100% accurate.